Packaging Design and SI/PI Engineer

Romania - Onsite working required

We are seeking a mid-to-senior level Packaging Design & Signal/Power Integrity (SI/PI) Engineer with an Electrical Engineering or related degree. You will help define and deliver advanced micro-electronic packaging solutions for a complex, high-performance system, working closely with silicon, photonics, and systems teams.

What you’ll do

• Own design and layout of advanced micro-electronic packages
• Define electrical and physical requirements with cross-functional engineering teams
• Run SI/PI simulations to optimize package and system performance
• Collaborate with vendors to ensure manufacturability and cost targets
• Track project progress and communicate updates weekly
• Produce technical reports and present results to stakeholders
• Maintain and improve EDA tools and design workflows

Required qualifications

• Bachelor’s degree in Electrical Engineering or related field + 5 years’ experience
• Experience in substrate design and advanced packaging
• Strong SI/PI simulation and analysis skills
• Proficiency with tools such as SIwave, HFSS, APD or equivalent
• Strong communication skills and ability to work across global teams
• Ability to handle confidential technical information

Preferred qualifications

• Master’s degree or higher
• Experience with packaging processes (flip-chip, wire bonding, die attach, etc.)
• Familiarity with tools like Altium, Allegro, Spectre, HSPICE, Sigrity, ADS
• Data analysis experience (JMP or Excel)
• Programming skills in Python or C++
• Experience testing electronic packages or systems